SEMICON China 2026 Concludes in Shanghai: Global Semiconductor Industry Gathers to Usher in Trillion-Dollar "Chip Era" Ahead of Schedule

SHANGHAI, March 27, 2026 – SEMICON China 2026, the world's largest and most influential annual semiconductor industry exhibition, successfully wrapped up today at the Shanghai New International Expo Centre (SNIEC). Held from March 25 to 27 under the theme "Crossing Borders, Connecting Hearts and Chips", the three-day event convened more than 1,500 leading enterprises from the global semiconductor supply chain and drew over 180,000 professional visitors, solidifying its role as the undisputed barometer of the industry.

Hosted by SEMI and the China Electronic Components Association (CECC), the exhibition covered an area of over 100,000 square meters, showcasing cutting-edge technologies, equipment, and materials across the entire semiconductor ecosystem, from IC design, wafer fabrication, and packaging & testing to equipment, materials, and related components. The event served as a pivotal platform for global industry leaders to address the transformative shifts driven by the AI revolution.

Trillion-Dollar Chip Era Arrives Early

In her opening keynote address, Lily Feng, President of SEMI China, delivered a landmark prediction: driven by the explosive growth of AI computing power and global digitalization, the global semiconductor industry is set to reach the historic milestone of a $1 trillion market value by the end of 2026, four years ahead of the original 2030 target.

Ms. Feng outlined three defining trends shaping the 2026 landscape:

1. AI Computing Power: Global AI infrastructure spending is projected to hit $450 billion in 2026, with inference computing accounting for over 70%, fueling unprecedented demand for GPUs, HBM, and high-speed networking chips.

2. Storage Revolution: The memory sector is poised to surpass foundry services as the industry's largest growth engine. The HBM market alone is expected to surge 58% to $54.6 billion, despite a significant 50-60% global production shortfall.

3. Industrial Upgrade: A profound shift from advanced node "nanometer races" to advanced packaging and 3D IC integration, led by technologies like Chiplet, 2.5D/3D heterogeneous integration, and Co-Packaged Optics (CPO).

Chinese Domestic Innovation Takes Center Stage

A major highlight of SEMICON China 2026 was the strong collective presence of nearly 40 high-tech semiconductor companies listed on China's STAR Market. This delegation, industry leaders such as AMEC (Advanced Micro-Fabrication Equipment Inc. China), TopSci, Hua Hong Semiconductor, and Gerber Technology, presented a comprehensive display of China's maturing, full-chain innovation capabilities.

· AMEC stole the spotlight by launching four major new products, including the Primo Angnova™ ICP etcher for 5nm-and-below advanced processes and the Primo Domingo™ high-selectivity etcher for 3D NAND and GAA architectures, marking significant progress in domestic high-end equipment.

· TopSci expanded its reach into advanced packaging with its new 3D IC series, featuring fusion bonding and laser lift-off technologies targeting Chiplet and HBM applications.

· Nauraexhibited a comprehensive equipment portfolio, including the NMC612H ICP etcher and Qomola HPD30 hybrid bonding tool, demonstrating its transition towards a full-platform solutions provider.

Global Collaboration and Future Tech Focus

The exhibition hosted a series of high-level forums, including the China Semiconductor Technology International Conference (CSTIC) and the Heterogeneous Integration (Advanced Packaging) International Conference, which centered on the theme "AI Computing Power and CPO"SEMICON China. Industry experts consensus that traditional electrical interconnects are hitting bottlenecks, making 2.5D/3D heterogeneous integration, silicon photonics, and HBM the critical technologies to unlock the next wave of AI performance.

Against a backdrop of global supply chain restructuring, SEMICON China 2026 underscored the irreplaceable role of the Chinese market. While international giants reinforced their commitments, the robust showing from domestic firms signaled China's strategic shift from individual technological breakthroughs to systematic, full-industry-chain collaboration and self-sufficiency.

As the show closed, SEMI confirmed that the event had successfully fostered global partnerships and charted the course for a trillion-dollar semiconductor future. With AI as the core engine, the industry is accelerating into a new era defined by interconnected innovation, cross-border collaboration, and the relentless pursuit of next-generation chip technologies.